A Sample of Recent Scientific Articles
Publications
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Z. Cai, J. C. Suhling, P. Lall, M. J. Bozack, “Mechanical Behavior of Low Silver Content SAC
Alloys Optimized for Portable Electronics,” (submitted, IEEE Trans. Components and
Packaging Technologies).
Y. Zhou, C. Ahyi, T. I. Smith, M. J. Bozack, C. C. Tin, J. R. Williams, M. Park, A. Cheng, J. H.
Park, D. Kim, and D. Wang, “Formation, Etching, and Electrical Characterization of a
Thermally Grown Gallium Oxide on the Ga-Face of a Bulk GaN Substrate,” Solid-State
Electron. 52 (2008) 756.
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, J. Hetke,
“Realization of Ultra-Fine Pitch Traces on LCP Substrates,” IEEE Trans. Components and
Packaging Technologies 31 (2008) 315.
H. Ma, J. C. Suhling, P. Lall, and M. J. Bozack, “Reliability of the Aging Lead-Free Solder
Joint” (submitted, IEEE Trans. Components and Packaging Technologies).
J. L. Evans, C. Mitchell, M. J. Bozack, L. Payton, M. R. McQueeney, and J. R. Thompson,
“Reliability of SAC BGA Using Sn-37Pb Solder Paste for Harsh Environment Electronics,”
(submitted, IEEE Trans. Components and Packaging Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
"Novel Biomedical Implant Interconnects Utilizing Micromachined LCP" (submitted, J.
Microlithography, Microfabrication, and Microsystems).
G. T. Flowers, F. Xie, M. J. Bozack, X. Hai, B. Rickett, and R. D. Malucci, “A Study of the
Physical Characteristics of Vibration-Induced Fretting Corrosion” (submitted, IEEE Trans.
Components and Packaging Technologies).
D. Wang, H. W. Seo, C.-C. Tin, M. J. Bozack, J. R. Williams, M. Park, N. Sathitsuksanoh, An-
jen Cheng, and Y. H. Tzeng, “Effects of Post-Growth Annealing Treatments on the
Photoluminescence of ZnO Nanorods” (accepted, J. Appl. Phys.).
G. T. Flowers, F. Xie, M. J. Bozack, R. Horvath, R. D. Malucci, and B. Rickett “Vibration
Testing of Fretting Corrosion in Electrical Connectors Subjected to Multi-Frequency and
Random Spectral Profiles” (accepted, IEEE Trans. of Components and Packaging
Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
“Micromachined LCP Connectors for Packaging MEMS Devices in Biological
Environments,” J. Microelectronics and Electronics Packaging 4 (2007) 17.
J. A. Davis, M. J. Bozack and J. L. Evans, “Reliability Impact of (Au, Ni)Sn4 Growth on Sn-
37Pb/ENIG Solder Joints under Isothermal and Temperature-Cycled Conditions,” IEEE
Trans. Components and Packaging Technologies 30 (2007) 32.
D. Wang, H. W. Seo, Y. H. Tzeng, C. C. Tin, M. J. Bozack, J. R. Williams, and M. Park,
“Lasing in Whispering Gallery Mode in ZnO Nanonails” J. Appl. Phys. 99, 093112 (2006).
H. W. Seo, D. Wang, Y. Tzeng, N. Sathitsuksanoh, C. C. Tin, M. J. Bozack, J. R. Williams,
and M. Park, “Growth and Characterization of ZnO Nanonail,” Mater. Res. Soc. Symp. Proc.
829, B2.26 (2005).
K. W. Bryant and M. J. Bozack, “Monolayer Growth Modes of Nb and Re on 4H-SiC
Surfaces” J. Appl. Phys 97 (2005) 24904.
M. J. Bozack and R. W. Johnson, “Real-Time Scanning Electron Microscopy and Auger
Spectroscopy of Sn-3.3Ag-4.8Bi Solder Paste Wetted to Ni-Au,” J. Elect. Mater. 34 (2005)
248.
M. J. Bozack, “Real-Time Wetting Dynamics and Interfacial Chemistry in Low-Melting 57Bi-
42Sn-1Ag Solder Paste on Ni-Au,” J. Vac. Sci. Technol. A 22 (2004) 2223.
S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, "Wetting
Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," IEEE Transactions
on Electronics Packaging Manufacturing, Vol 25, July 2002, 168-184.
Alloys Optimized for Portable Electronics,” (submitted, IEEE Trans. Components and
Packaging Technologies).
Y. Zhou, C. Ahyi, T. I. Smith, M. J. Bozack, C. C. Tin, J. R. Williams, M. Park, A. Cheng, J. H.
Park, D. Kim, and D. Wang, “Formation, Etching, and Electrical Characterization of a
Thermally Grown Gallium Oxide on the Ga-Face of a Bulk GaN Substrate,” Solid-State
Electron. 52 (2008) 756.
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, J. Hetke,
“Realization of Ultra-Fine Pitch Traces on LCP Substrates,” IEEE Trans. Components and
Packaging Technologies 31 (2008) 315.
H. Ma, J. C. Suhling, P. Lall, and M. J. Bozack, “Reliability of the Aging Lead-Free Solder
Joint” (submitted, IEEE Trans. Components and Packaging Technologies).
J. L. Evans, C. Mitchell, M. J. Bozack, L. Payton, M. R. McQueeney, and J. R. Thompson,
“Reliability of SAC BGA Using Sn-37Pb Solder Paste for Harsh Environment Electronics,”
(submitted, IEEE Trans. Components and Packaging Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
"Novel Biomedical Implant Interconnects Utilizing Micromachined LCP" (submitted, J.
Microlithography, Microfabrication, and Microsystems).
G. T. Flowers, F. Xie, M. J. Bozack, X. Hai, B. Rickett, and R. D. Malucci, “A Study of the
Physical Characteristics of Vibration-Induced Fretting Corrosion” (submitted, IEEE Trans.
Components and Packaging Technologies).
D. Wang, H. W. Seo, C.-C. Tin, M. J. Bozack, J. R. Williams, M. Park, N. Sathitsuksanoh, An-
jen Cheng, and Y. H. Tzeng, “Effects of Post-Growth Annealing Treatments on the
Photoluminescence of ZnO Nanorods” (accepted, J. Appl. Phys.).
G. T. Flowers, F. Xie, M. J. Bozack, R. Horvath, R. D. Malucci, and B. Rickett “Vibration
Testing of Fretting Corrosion in Electrical Connectors Subjected to Multi-Frequency and
Random Spectral Profiles” (accepted, IEEE Trans. of Components and Packaging
Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
“Micromachined LCP Connectors for Packaging MEMS Devices in Biological
Environments,” J. Microelectronics and Electronics Packaging 4 (2007) 17.
J. A. Davis, M. J. Bozack and J. L. Evans, “Reliability Impact of (Au, Ni)Sn4 Growth on Sn-
37Pb/ENIG Solder Joints under Isothermal and Temperature-Cycled Conditions,” IEEE
Trans. Components and Packaging Technologies 30 (2007) 32.
D. Wang, H. W. Seo, Y. H. Tzeng, C. C. Tin, M. J. Bozack, J. R. Williams, and M. Park,
“Lasing in Whispering Gallery Mode in ZnO Nanonails” J. Appl. Phys. 99, 093112 (2006).
H. W. Seo, D. Wang, Y. Tzeng, N. Sathitsuksanoh, C. C. Tin, M. J. Bozack, J. R. Williams,
and M. Park, “Growth and Characterization of ZnO Nanonail,” Mater. Res. Soc. Symp. Proc.
829, B2.26 (2005).
K. W. Bryant and M. J. Bozack, “Monolayer Growth Modes of Nb and Re on 4H-SiC
Surfaces” J. Appl. Phys 97 (2005) 24904.
M. J. Bozack and R. W. Johnson, “Real-Time Scanning Electron Microscopy and Auger
Spectroscopy of Sn-3.3Ag-4.8Bi Solder Paste Wetted to Ni-Au,” J. Elect. Mater. 34 (2005)
248.
M. J. Bozack, “Real-Time Wetting Dynamics and Interfacial Chemistry in Low-Melting 57Bi-
42Sn-1Ag Solder Paste on Ni-Au,” J. Vac. Sci. Technol. A 22 (2004) 2223.
S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, "Wetting
Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," IEEE Transactions
on Electronics Packaging Manufacturing, Vol 25, July 2002, 168-184.
